Course #37

Micro Fabrication Technology for MEMS and NEMS

October 18-20, 2010. Dresden, Germany

INSTRUCTOR
Professor Stella W. Pang, University of Michigan, Ann Arbor, USA

TECHNOLOGY FOCUS 
In Micro Electro Mechanical Systems (MEMS), and Nano Electro Mechanical Systems (NEMS), both electrical and mechanical devices are formed. Often, the mechanical devices consist of movable components that are partially separated from the substrate they are anchored to. In some cases, special films with unique properties for sensing or mechanical movement are needed. Although the basic principles of the IC technologies used in silicon can be applied, there are many unique requirements for MEMS fabrication.

COURSE CONTENT 
In this course, various micro- and nano-fabrication technologies for MEMS/NEMS will be introduced. Process design and factors for precise dimension control for MEMS/NEMS will be covered. Issues related to integrating mechanical and electrical components will be discussed. Current technology trends for MEMS/NEMS with examples in mechanical, optical, and chemical sensing and actuation will be given. The new development of MEMS/NEMS technology will be addressed. 

Monday 

MEMS/NEMS Overview 

• Definition of MEMS/NEMS 
• MEMS History and Development 
• MEMS NEMS Examples 
• Resources for MEMS 

MEMS Requirements 

• Complex 3D Microstructures 
• Technology Considerations 
• Material Requirements 
• Measured Signals and Performance 

Patterning Technology for MEMS/NEMS

• Lithographic Patterning: Patterning by optical, X-ray, electron beam, and focused ion beam, and nanoimprint lithography 
• Selective Wet Etching Processes 
• Directional Dry Etching Processes 
• Thin Film Deposition: Evaporation, sputtering, electroplating, chemical vapor deposition, and laser assisted deposition 

Tuesday

Micromachining Technology 

• New Materials for MEMS/NEMS
• Surface Micromachining 
• Bulk Micromachining
• Release of Microstructures 

MEMS Packaging and Integration 

• Wafer Bonding
• Chemical Mechanical Polishing 
• Packaging and Circuit Integration 
• Sensors and Circuits Integration 

Wednesday 

MEMS Design and Applications 

• Design of Sensors and Actuators: MEMS/NEMS technology for mechanical, optical, and chemical sensors 
• Integrated Microsystems
• MEMS/NEMS Applications 

Future Trends and Developments 

• Mechanical, Optical, Biomedical, and Chemical Transducers 
• Multidisciplinary Applications and Development 
• Miniaturized, Portable, Low Power, Low Cost, Multiple Functions, and High Performance Microsystems 

Regular Course Fee: EUR 1915

Early Registration Course Fee:  EUR 1720
This applies to firm registrations received 2 months before course start. 

University Student and Faculty Rate:
Two university participants are welcome to attend for one course fee if payment is to be made from university funds.

Deliverables:
The course fee covers tuition, course material, and the day conference packages (morning/afternoon refreshments, lunches etc) paid on your behalf to the course venue. 
Accommodation is not included.