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65  Megafunction Electronics and Photonics Based on 3D Integration
The further diversification and growth of Si-based semiconductor and polymer-based thin-film industry rely on technical and economic targets. Several technologies are emerging currently, and detailed knowledge is needed to increase performance and efficiency, high yield and product reliability. Performance increase of advanced products will be determined by system performance and not by individual elements. This will challenge assembly and packaging of microelectronic and multi-functional products. The 3D integration approach has to be implemented to make systems more efficient and will increase their performance significantly.
66  Advanced Photovoltaics and Electronics: Device Reliability and Lifetime Performance Applications for Thin Film Electronics and Photovoltaics 
The further diversification and growth of semiconductor industry and the rapid growth of photovoltaic industry, including thin film photovoltaics, rely on technical and economic targets. Several technologies are emerging currently, such as new devices and materials, thin films based on Si or inorganic compound semiconductors, as well as inorganic and organic nanostructures and nano-composites. Potential degradation mechanisms in thin films and nanostructures, that determine the long-term behavior of devices and the reliability of products, needs to be studied for each technology. The integration of new materials is a particular challenge. Experimental studies and modeling/simulation are needed to provide the knowledge, which will be necessary to guarantee the required product reliability.

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