Micro Fabrication Technology for MEMS and NEMS - CEI-Europe
Course #37

Micro Fabrication Technology for MEMS and NEMS

We recommend you to submit your preliminary or firm registration at least 4 weeks before course start to ensure a seat on the course.

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TECHNOLOGY FOCUS

In Micro Electro Mechanical Systems (MEMS), and Nano Electro Mechanical Systems (NEMS), both electrical and mechanical devices are formed. Often, the mechanical devices consist of movable components that are partially separated from the substrate they are anchored to. In some cases, special films with unique properties for sensing or mechanical movement are needed. Although the basic principles of the IC technologies used in silicon can be applied, there are many unique requirements for MEMS fabrication.

COURSE CONTENT
In this course, various micro- and nano-fabrication technologies for MEMS/NEMS will be introduced. Process design and factors for precise dimension control for MEMS/NEMS will be covered. Issues related to integrating mechanical and electrical components will be discussed. Current technology trends for MEMS/NEMS with examples in mechanical, optical, and chemical sensing and actuation will be given. The new development of MEMS/NEMS technology will be addressed.

The specific topics covered are:

  • Patterning by optical, X-ray, electron beam, focused ion beam, and nanoimrint lithography
  • Selective wet etching processes
  • Directional dry etching processes
  • Thin film deposition by evaporation, sputtering, electroplating, chemical vapor deposition, and laser assisted deposition
  • New materials for MEMS/NEMS
  • Bonding and release of mechanical structures
  • Packaging and Circuit Integration
  • MEMS/NEMS technology for mechanical, optical, and chemical sensors
  • Future trends and development in MEMS/NEMS technology

WHO SHOULD ATTEND
Engineers, scientists, technologists, consultants, and other professionals with an interest in the development and implementation of microfabrication technology for microelectromechanical systems.

COURSE OBJECTIVES

  • Learn various microfabrication technologies for MEMS/NEMS
  • Understand unique requirements for MEMS fabrication
  • Learn process design and control
  • Learn merging of mechanical devices with circuits
  • Learn MEMS applications
  • Learn current trends and future technology for MEMS


Monday
MEMS/NEMS Overview

  • Definition of MEMS/NEMS
  • MEMS History and Development
  • MEMS/NEMS Examples
  • Resources for MEMS

MEMS Requirements

  • Complex 3D Microstructures
  • Technology Considerations
  • Material Requirements
  • Measured Signals and Performance

Patterning Technology for MEMS/NEMS

  • Lithographic Patterning: Patterning by optical, X-ray, electron beam, and focused ion beam, and nanoimprint lithography
  • Selective Wet Etching Processes
  • Directional Dry Etching Processes
  • Thin Film Deposition: Evaporation, sputtering, electroplating, chemical vapor deposition, and laser assisted deposition

Tuesday
Micromachining Technology

  • New Materials for MEMS/NEMS
  • Surface Micromachining
  • Bulk Micromachining
  • Release of Microstructures

MEMS Packaging and Integration

  • Wafer Bonding
  • Chemical Mechanical Polishing
  • Packaging and Circuit Integration
  • Sensors and Circuits Integration

Wednesday
MEMS Design and Applications

  • Design of Sensors and Actuators: MEMS/NEMS technology for mechanical, optical, and chemical sensors
  • Integrated Microsystems
  • MEMS/NEMS Applications

Future Trends and Developments

  • Mechanical, Optical, Biomedical, and Chemical Transducers
  • Multidisciplinary Applications and Development
  • Miniaturized, Portable, Low Power, Low Cost, Multiple Functions, and High Performance Microsystems

 

citatteckenSaid about the course from previous participants:
"It covered a broad range of subjects, very actual and up-to-date techniques, and very good teacher."
"Very good teacher, she perfectly masters what she is saying. Organization of lectures, organization of course. "
"Very detailed, very well explained slides and lecture notes."
"The balance between the broad overview (e g applications) and the details (e g etching).
"Good overview of a lot of fabrication aspects and methods."
"Large overview of technologies and applications."
"Course provides a good coverage of the major aspects of MEMS and describes well the devices that are being made today."




CEI-Europe AB, Teknikringen 1F, SE-583 30 Linköping, Sweden Phone +46-13-100 730 Fax +46-13-100 731 cei@cei.se