PhD, IBM Microelectronics, Essex Junction, Vermont,
USA
Dr. Gambino received the B.S. degree in materials science
from Cornell University, Ithaca, NY, in 1979, and the PhD degree in
materials science from the Massachusetts Institute of Technology,
Cambridge, MA, in 1984.
He joined IBM, Hopewell Junction, NY, in 1984, where he worked
on silicide processes for Bipolar and CMOS devices. In 1992, he
joined the DRAM development alliance at IBM's Advanced
Semiconductor Technology Center, Hopewell Junction, NY. While
there, he developed contact and interconnect processes for 0.25-,
0.175-, and 0.15-um DRAM products. In 1999, he joined IBM's
manufacturing organization in Essex Junction, VT, where he has
worked on copper interconnect processes for CMOS logic technology.
He has published over 90 technical papers and holds over 100
patents.
Dr. Gambino has been a member of the CEI-Europe faculty since
2007.
Course #36
Silicon Device Technology: Materials and Processing
Overview
Course #95
Copper Low k Interconnect Technology: Processing and Reliability of
Cu Low k Interconnect Metallization
Course #65
Megafunction Electronics and Photonics Based on 3D
Integration
Applications for 3D Si-based ICs, Flexible Polymer
Electronics,
Thin Film Solar Cells and OLEDs