Professor of Materials Science and Engineering and holder
of the Cockrell Family Regents Chair in Engineering at The
University of Texas at Austin.
Dr. Paul S. Ho is the Director of the Laboratory for Interconnect
and Packaging at The University of Texas at Austin. He received his
B.S. degree in mechanical engineering from National Chengkung
University, Taiwan; M.S. degree in physics from National Tsinghua
University, Taiwan; and Ph.D. degree in physics from Rensselaer
Polytechnic Institute.
He joined the Materials Science and Engineering Department at
Cornell University in 1966 and became an Associate Professor in
1972. In 1972, he joined the IBM T.J. Watson Research Center and
has held a number of management positions. In 1985, he became
Senior Manager of the Interface Science Department. In 1991, he
joined the faculty at The University of Texas at Austin and was
appointed the Cockrell Family Regents Chair in Materials Science
and Engineering. His current research is in the areas of materials
and processing science for interconnect and packaging for
microelectronics. He received the Outstanding Alumni Achievement
Award from National Chengkung University in 1992, the Michel Lerme
Award from the International Interconnect Technology Conference in
1999 and the Thomas D. Callihan Award of the Dielectric Science and
Technology Division, The Electrochemical Society 199th Meeting,
Washington, D.C., March 25-30, 2001. He holds the inventorship of
11 U.S. Patents in microelectronics technology.
He has edited six books and published extensively in the area of
thin films and materials science for microelectronics. He is a
Fellow of the American Physical Society, the American Vacuum
Society and IEEE.
Professor Ho has been a member of the CEI-Europe Faculty since
1983.
Course #36
Silicon Device Technology: Materials and Processing
Overview
Course #75
Chip Interconnection Technology and Process Integration