CEI-Europe Course Number
Hands-on Characterization of Solid-State Image Sensors
Nov 25-26, 2010. Barcelona, Spain.
Advanced Lithography Technologies: Fundamentals and Applications
Oct 18-22, 2010. Dresden, Germany
Linearisation and Modelling Techniques for RF Power Amplifiers in Modern Communications Systems
Oct 4-7, 2010. Copenhagen, Denmark
Analog Signal Processing and Related Bipolar and CMOS Circuit Design
New date to be decided
Advanced RF Power Amplifier Techniques for Modern Wireless and Microwave Systems
Oct 25-28, 2010. Barcelona, Spain
Re-scheduled to
November 22-25, 2010. Baercelona, Spain
RF and Microwave Filter Design with EM Simulation
Spring 2011
Digital Signal Analysis Techniques: Time, Frequency, and Spatial Algorithms
Spring 2011
Embedded Data Converters
Oct 25-28, 2010. Barcelona, Spain
Digital Imaging: Image Capturing, Image Sensors, Technologies and Applications
Oct 4-8, 2010. Copenhagen, Denmark
Digital Camera Systems
Oct 25-28, 2010. Barcelona, Spain
Design and Simulation of RF Systems
Oct 4-8, 2010. Copenhagen, Denmark
CMOS/BiCMOS Process Integration and Engineering
Oct 18-22, 2010. Dresden, Germany
Phased Array Antennas for Communications and Radar
New date and location to be decided
RF/MW Circuit Design: Applications and Theory
2011, location to be decided.
Advanced Course on Image Sensor Technology
Nov 22-23, 2010. Barcelona, Spain
Advanced Array Antennas: Conformal Arrays and Digital Beamforming
Oct 25-28, 2010. Barcelona, Spain
Antennas for Communications Including Printed Circuit Board Antennas
New date to be decided.
Satellite Communication Systems
Oct 25-29, 2010
Far-Field, Anechoic Chamber, Compact, and Near-Field Antenna Measurement Techniques
New date and location to be decided
Radio System Design - Theory and Practice
Nov 22-26, 2010. Barcelona, Spain
Advanced Radio System Architectures
Oct 4-6, 2010. Copenhagen, Denmark
Electromagnetic Compatibility, EMC: Designing for Compliance
New date to be decided
Silicon Device Technology: Materials and Processing Overview
Oct 18-22, 2010. Dresden, Germany
Micro Fabrication Technology for MEMS and NEMS
Oct 18-20, 2010. Dresden, Germany
3GPP LTE: Long Term Evolution -
The Future UMTS Standard
Nov 22-24, 2010. Barcelona, Spain
3GPP Long Term Evolution Protocol, Services, and Architecture
Nov 25-26, 2010. Barcelona, Spain
Electromagnetic Shielding Engineering for Wired and Wireless Communications and Electronics
New date and location to be decided
EMC Engineering for Wired and Wireless Electronics
New date and location to be decided
MIMO and Beamforming for 4G Wireless with Applications to LTE and WiMax
New date to be decided
4G - Fourth Generation Wireless Networking
New date to be decided
Digital Speech Transmission - Enhancement Coding and Error Concealment
Oct 25-28, 2010. Barcelona, Spain
Thin Film Deposition at the Nanoscale: Mechanisms and Application (Bi-Annual)
2012. Uppsala, Sweden
Course #55
Signal Integrity: Advanced High-Speed Design and Characterization
Oct 4-8, 2010. Copenhagen, Denmark
Course #56
Power Integrity: Advanced Design and Characterization
Nov 22-26, 2010. Barcelona, Spain
Synchronization and Interconnect in Multi-Clock Domain Systems-on-Chips, SoC
Oct 26-29, 2010. Barcelona, Spain
Modern Digital Modulation Techniques for Wireless, Satellite, and Wireline Communications
Oct 4-8, 2010. Copenhagen, Denmark
OFDM and MIMO Wireless Technologies with Applications to WiMax and UMTS LTE
Oct 25-28, 2010. Barcelona, Spain
Postponed to April 11-14, 2011. Barcelona, Spain
Grounding and Shielding: The Essence of EMC Design
New date to be decided
Yield and Reliability in VLSI Development and Manufacturing
Oct 18-22, 2010. Dresden, Germany
IC Debug, and Fault Isolation
Oct 20-21, 2010. Dresden, Germany
Next Generation Networks: Broadband Infrastructure, ATM Switching, High-Speed LAN Systems, The Internet Architecture, and Wireless/Mobile Technology
New date and location to be decided
Megafunction Electronics and Photonics Based on 3D Integration: Applications for 3D Si-based ICs, Flexible Polymer electronics, Thin Film Solar Cells, and OLEDS
Oct 18-19, 2010. Dresden, Germany
Advanced Photovoltaics and Electronics:
Device Reliability and Lifetime Performance Applications for Thin Film
Electronics and Photovoltaics
Oct 21-22, 2010. Dresden, Germany
High-Speed PCB Design for EMC and Signal Integrity
Oct 25-29, 2010. Barcelona, Spain
Chip Interconnection Technology and Process Integration
Oct 18-20, 2010. Dresden, Germany
Modulation, Coding, and Iterative Techniques for Optimal Detection in Wireless Communications
Nov 22-26, 2010. Barcelona, Spain
Phase Locked Loops for Wireless Communication Systems
Nov 22-25, 2010. Barcelona, Spain
RF Component and System Measurements
Oct 4-7, 2010. Copenhagen, Denmark
Plasma-Assisted Etching and Reactive Ion Etching Using High and Low Density Plasmas
Oct 18-19, 2010. Dresden, Germany
Plasma Etching for CMOS Technology and ULSI Applications
Oct 20-22, 2010. Dresden, Germany
RF Transceiver Architecture, System Design, and Evaluation for Wireless Systems
New date and location to be decided
Applied Radio Design: From System Architecture to PCB Implementation
New date and location to be decided
Copper-Low-k Interconnect Technology: Processing and Reliability of Cu Low-k Interconnect Metallization
Oct 20-22, 2010. Dresden, Germany
CEI-Europe AB, Repslagaregatan 19,
SE-582 22 LINKÖPING, Sweden
Phone +46-13-100 730 Fax +46-13-100 731