Megafunction Electronics and Photonics Based on 3D Integration

New date to be decided

TECHNOLOGY FOCUS 
The further diversification and growth of Si-based semiconductor and polymer-based thin-film industry rely on technical and economic targets. Several technologies are emerging currently, and detailed knowledge is needed to increase performance and efficiency, high yield and product reliability. Performance increase of advanced products will be determined by system performance and not by individual elements. This will challenge assembly and packaging of microelectronic and multi-functional products. The 3D integration approach has to be implemented to make systems more efficient and will increase their performance significantly. 

COURSE CONTENT 
This course will provide knowledge of specific technologies for 3D chip integration, polymer electronics, thin film solar cells, and OLEDs, including integrated analysis and metrology solutions. Assembly and packaging strategies for 3D integration and their interaction with backend-ofline on-chip interconnect structures will be discussed. Technology routes for 3D integration, including ThroughSilicon-Via technology, will be explained, technical and cost aspects will be reviewed.The role of mechanical stress will be explained and analytical techniques for process control and failure analysis will be discussed. 

WHO SHOULD ATTEND
The course is intended for scientists and engineers in both Si-based and polymer-based thin-film industry, both electronics and optoelectronics. It is addressed to experts who need state-of-the-art knowledge for 3D IC integration, polymer electronics and photovoltaics, and OLED manufacturing. 


Monday - J. Gambino am -E. Zschech pm 
ON-CHIP INTERCONNECTS AND 3D INTEGRATION 

System Integration and Technologies 

With device scaling beyond the 90nm node, on-chip interconnects become increasingly important in limiting chip density and performance. A number of changes are being made in IC fabrication and packaging to avoid these limitations. To improve circuit performance, Cu interconnects with low permittivity are being used instead of Al wires and SiO2 insulators. Stacked packaging is being used to provide improved form factor for portable devices. Finally, 3D integration of ICs with high densities of vertical interconnects are evaluated for future technologies, for improved circuit density and performance. This lecture will provide an introduction to the processing and reliability of on-chip interconnects, stacked packaging, and 3D integration.

Analytical Techniques for Process Control and 
Failure Analysis 
For advanced technologies and increasingly complex products with poly-functionality, new analytical techniques have to be integrated into the manufacturing process for process development and process control. In addition, high-resolution failure localization and analysis techniques, including deprocessing and sample preparation, are needed for a complex physical failure analysis to ensure high yield and the requested product reliability. Potential degradation mechanisms in microelectronic devices and products, particularly in interconnects, that determine their long-term behavior and consequently reliability, will be explained. Thin film and stress characterization techniques will be discussed for several types of thin films and technologies. Nanomechanical properties of thin films as well as analytical techniques to characterize adhesion and cohesive strength of thin films will be explained. 

Tuesday - I. McCulloch am -K. Leo/B. Luessem/M. Riede pm 
POLYMER-BASED PHOTONIC AND ELECTRONIC DEVICES AND PRODUCTS 

Polymer Electronics 
This lecture will cover firstly the design and synthesis of organic semiconductors for both transistor and solar cells, followed by characterisation and processing of organic transistors and some organic electronic applications. We will build knowledge from the ground up, starting from the molecular structure of the most relevant materials up to the most exciting technological applications of organic semiconductors. 

The fundamentals of organic semiconductor molecular structure will be described, and the subsequent impact on electronic energy levels and microstructure discussed. Semiconductor stability will be examined. The inter-relationships between organic semiconductor molecular conformation, thin film morphology, and charge transport in field-effect transistors will be discussed. Particular emphasis will be on polymeric semiconductors, and the impact of backbone structure and pi-electron delocalisation and density on the frontier molecular orbital energy levels will be highlighted with respect to solar cell performance. Other transistor device materials, such as electrodes and dielectrics, will be reviewed. Thiophene containing polymers will provide examples to illustrate molecular design principles. 

The basic working principles of field-effect transistors will be explained using relevant examples of device architecture. 

Photonic Devices 
Organic semiconductors with conjugated electron system are currently intensively investigated for optoelectronic applications.This interest is spurred by novel devices such as organic light-emitting diodes (OLED), and organic solar cells. In this lecture, recent progress on highly efficient OLEDs and solar cells, in particular results using doped transport layers, will be discussed. The concept of molecular doping allows to manufacture green OLED devices with the highest efficiencies reported so far, well exceeding the efficiency of current inorganic GaN LED! White OLEDs have recently achieved very high efficiencies of 90lm/W, significantly higher than fluorescent tubes, opening the path to a new form of high-efficiency area lighting devices. Organic solar cells, where certified efficiencies exceeding 7% have been reached, will be discussed. Finally, deposition technologies for large-area devices, including both deposition on glass substrates and roll-to-roll deposition on foils, will be explained.

See also Course #66 Advanced Photovoltaics and Electronics:  Device Reliability and Lifetime Performance Applications for Thin Film Electronics and Photovoltaics
Conveniently scheduled October 21-22, 2010. Dresden, Germany