October 08 - 10, 2018. Dresden, Germany.
Expand your knowledge of the processing, materials, and reliability aspects of on-chip interconnects and 3D-stacked integrated circuits.
Let Professor Zschech and Dr. Gall guide you all the way from deposition and patterning of metal and dielectric films up to the performance and reliability challenges of the rapidly evolving 3D TSV technology.
This 3-day course will provide an overview of processes, materials and reliability for on-chip and 3D TSV interconnects.This course will include novel aspects of the mobile communication and connectivity, as well as applications in automotive industry in particular.