Overview

Professor Ehrenfried Zschech, Fraunhofer Institute for Ceramic Technologies and Systems in Dresden, Germany is teaching this 3-day course in 3D TSV Integration Technology and 3D Interconnects.


Expand your knowledge of the processing, materials, performance and reliability aspects of 3D TSV Integration Technology and 3D Interconnects in Stacked Integrated Circuits. Let Professor Zschech guide you all the way from advanced packaging concepts through technology up to the performance and reliability challenges. This course will include novel aspects of mobile communication and connectivity, as well as demands for applications in automotive industry.

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Course 077 3D Interconnects – Technology, Performance, and Reliability
Location
Date
Open Course Price
Preliminary Booking
Dresden, Germany
Course 077 3D Interconnects – Technology, Performance, and Reliability
June 05 - 07, 2019
Early Bird €1,885.00 Regular Price €2,095.00

Early Bird Price valid until: Apr 08, 2019

Instructor
Instructor Zschech Element
Professor Ehrenfried Zschech

Professor Dr. Zschech is Department Head for Microelectronic Materials and Nanoanalysis at Fraunhofer Institute for Ceramic Technologies and Systems in Dresden, Germany.

Dr Zschech has been a member of the Continuing Education Institute-Europe Faculty since 2009.
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