October 09 - 11, 2018. Dresden, Germany.
Professor Ehrenfried Zschech, Fraunhofer Institute for Ceramic Technologies and Systems in Dresden, Germany is teaching this 3-day course in 3D TSV integration technology and 3D Interconnects.
Expand your knowledge of the processing, materials, performance and reliability aspects of 3D TSV integration technology and 3D interconnects in stacked integrated circuits. Let Professor Zschech guide you all the way from advanced packaging concepts through technology up to the performance and reliability challenges. This course will include novel aspects of mobile communication and connectivity, as well as demands for applications in automotive industry.
This course will provide an overview of processes, materials and reliability for on-chip and 3D TSV interconnects.This course will include novel aspects of the mobile communication and connectivity, as well as demands for applications in automotive industry .
Early Bird Price valid until: Aug 10, 2018