Overview

October 08 - 11, 2018. Dresden, Germany.

This course is intended to provide an understanding of plasma processes for CMOS applications and ULSI technology. We will discuss fundamental and practical aspects of front end and back end plasmaprocesses for deep submicron CMOS logic processes.  


The course is based on experimental results obtained using commercial etchers connected to very powerful diagnostics of the plasma and the plasma surface interaction.

The discussions cover several aspectsof etch processes of materials integrated in advanced CMOS devices,etch mechanisms, and situations that may be encountered for some important plasma processes.

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Instructor
Instructor Dr. Maxime Darnon Element
Dr. Maxime Darnon

PhD at LN2/CNRS, Sherbrooke, Canada.

Dr. Darnon has been a member of the Continuing Education Institute-Europe faculty since 2011.

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Early Bird €2,425.00 Regular Price €2,695.00

Early Bird Price valid until: Aug 03, 2018