075 Heterogeneous integration of chiplets – Defect inspection, metrology and failure analysis

Driven by the consumer’s thirst for AI-based applications and the growing market need of advanced electronic products for high-performance computing, semiconductor industry is exploring innovative ways to deliver more functionality in increasingly smaller packages. Three-dimensional (3D) heterogeneous integration and advanced packaging are enabler to extend the promise of Moore’s Law and to lower the power consumption. However, to ensure high manufacturing yield and the requested product reliability is challenging. Solder-based 3D-stacking and hybrid bonding require different approaches for metrology, defect inspection and package failure analysis.

This course provides an overview of workflows and techniques for defect inspection, metrology, and package failure analysis of advanced microelectronic products. Technology trends and advanced packaging concepts will be discussed. Challenges and needs for fault isolation and failure analysis are addressed, workflows for robust and high-speed defect localization and inspection are discussed. New materials and processes as well as their integration are highlighted, including solutions to achieve high manufacturing yield and to mitigate product reliability issues. The kinetics of thermomechanical and electrical reliability-limiting degradation processes, enforced by package stress, are explained, and ways for an effective reliability engineering are shown. The potential of high-resolution 3D X-ray imaging techniques for fault isolation, defect inspection and metrology as well as reliability engineering is emphasized.

The goal for this 3-days training course is to help establish a high level of knowledge transfer on fault isolation and package failure analysis of advanced microelectronic products to achieve better understanding of analytical techniques for metrology, defect inspection and physical failure analysis as well as of degradation processes that eventually cause failures. This course is intended for engineers who wish to expand their knowledge in heterogeneous integration and advanced packaging, including concept, technology, materials, performance, and reliability aspects of advanced microelectronic products.