Mr. Vallett has over 35 years of engineering and management experience in the characterization and failure analysis of wafer and package level integrated circuits, specializing in fault isolation using optical, thermal, magnetic, and electron/ion beam imaging and stimulation techniques. He shared in IBM's Outstanding Technical Achievement award for development of Picosecond Imaging Circuit Analysis (PICA) using time-resolved photon emission microscopy. Presently he consults in advanced IC imaging and analysis technology, lectures internationally, and provides scanning magnetic microscopy services.
He is widely published with five best-paper awards, holds eighteen US patents, and is a senior member of the IEEE and a member of EDFAS - the Electronic Device Failure Analysis Society. In 2008 he was the General Chair for ISTFA - the International Symposium for Testing and Failure Analysis and is a past chair of the International SEMATECH Product Analysis Forum. Mr. Vallett holds the BS degree in electrical engineering from the University at Buffalo, NY and was named a Fellow of ASM International in 2016.
Mr. Vallett has been a member of the Continuing Education Institute-Europe faculty since 2005.
Course 061 IC Reliability, Yield, Failure Analysis, and Fault Isolation