Mr. David Vallett, PeakSource Analytical, LLC, Fairfax, VT, USA; Reliability Failure Analysis Manager (retired) IBM Systems & Technology Group, Essex Junction, VT, USA
Mr. Vallett has over 35 years of engineering and management experience in the characterization and failure analysis of wafer and package level integrated circuits, specializing in fault isolation using optical, thermal, magnetic, and electron/ion beam imaging and stimulation techniques. He shared in IBM's Outstanding Technical Achievement award for development of Picosecond Imaging Circuit Analysis (PICA) using time-resolved photon emission microscopy. Presently he consults in advanced IC imaging and analysis technology, lectures internationally, and provides scanning magnetic microscopy services.
He is widely published with five best-paper awards, holds eighteen US patents, and is a senior member of the IEEE and a member of EDFAS - the Electronic Device Failure Analysis Society. In 2008 he was the General Chair for ISTFA - the International Symposium for Testing and Failure Analysis and is a past chair of the International SEMATECH Product Analysis Forum. Mr. Vallett holds the BS degree in electrical engineering from the University at Buffalo, NY and was named a Fellow of ASM International in 2016.
Mr. Vallett has been a member of the Continuing Education Institute-Europe faculty since 2005.
Dr. Croes is the group leader of the Reliability, Electrical test and Modeling group at IMEC.
Kristof Croes received his BSc in physics at the Catholic University of Louvain (Belgium) in 1993 and his MSc in biostatistics at the Limburgs Universitair Centrum (LUC) in 1994. In 1999, he obtained his PhD, concerning the development of statistical techniques for planning reliability experiments.
Dr. Croes joined the reliability business unit of XPEQT in 1999, first as the software responsible and then as the manager of the R&D. From 2003 till end 2006, he was product and application manager of the package level reliability products of the Singaporean based company Chiron holdings. In 2007 he went back to research, working as a BEOL reliability engineer in imec in Belgium.
Currently Dr. Croes is group leader of the Reliability, Electrical test and Modeling group at imec, working on test, characterization (electrical, thermal and (thermo)-mechanical) and reliability with main focus on advanced interconnects (2D, 3D, OIO).
Dr. Croes is a new member of the Continuing Education Institute-Europe faculty as of 2016.
Course 061 IC Reliability, Yield, Failure Analysis, and Fault Isolation