TECHNOLOGY FOCUS
The computing power packed into a tiny microchip has exploded over the past several decades. A huge driver has been phenomenally successful continuous evolution in microchip fabrication equipment, materials and techniques. With each new generation of chips, as devices are scaled ever-tinier and performance requirements are ever more demanding, comes a wide range of exciting yet onerous new processing challenges, met head-on by highly motivated scientists and engineers.
The course is not geared to a particular technology node; it considers the wide range of fab processes and technology nodes in volume production today.
COURSE CONTENT
This 5-day course examines the entire wafer fab process, from Fab In through Parametric Test. (It also includes the details of raw Si wafer production.) Each processing technique is studied in turn. A baseline CMOS process flow is studied to introduce critical concepts of process integration. While knowledge of wafer fabrication would certainly be an asset, it is not a prerequisite. Participants will be encouraged to ask questions and to participate in brief discussions. The highly detailed course notes provided will minimize the need for note-taking during class and will serve as an excellent useful post-course reference.
WHO SHOULD ATTEND
This course is geared to a broad audience. While certainly technical in nature, it aims to also be highly practical, with a minimum of complex math and physics. Past participants have included scientists, engineers and technologists from a wide range of wafer fab equipment and materials supplier companies. Participants from wafer fabs have included process engineers, equipment engineers, yield engineers, process integration engineers, product engineers and technical managers.
Daily Schedule
The course material is arranged into 20 modules, four per day:
Module 1: Basics and Fundamentals; Semiconductor Devices and ICs
Initialisms and Acronyms
• The Language of Wafer Fab
• Brief History (e.g., evolution of electronic devices and ICs; scaling)
• Electrical Conductivity
• Semiconductor Devices (diodes, resistors, capacitors, transistors, MOSFETs)
• Common CMOS Device Problems
• Classification of ICs and IC Processes
• Integrated Circuit Types
• The Global Semiconductor Market
Module 2: Si Crystallinity, Crystal Defects, Crystal Growth
• Crystallinity
• Crystal Defects
• Crystal Growth (from sand to ingots to polished wafers)
• Controlling Crystal Defects
Module 3: Baseline CMOS Process Flow
• Summary of Wafer Fab Process Techniques
• Baseline CMOS Process Flow (step by step)
• Process Evolution
Module 4: Ion Implantation 1: The Science
• Doping Fundamentals
• Ion Implantation Fundamentals
• Dopant Profiles
• Crystal Damage and Annealing
Module 5: Ion Implantation 2: Ion Implant Technology
• Ion Implant Equipment
• Process Challenges
• Process Monitoring and Characterization
• Newer Doping Techniques (e.g., PLAD, GILD)
Module 6: Thermal Processing
• Overview of Thermal Processing
• Process Applications of SiO2
• Thermal Oxidation
• Thermal Diffusion
• Thermal Annealing
• Thermal Nitridation
• Process Control
• Thermal Processing Equipment
• Newer Process Techniques (e.g., LSA, SPE, PO)
Module 7: Contamination Monitoring and Control
• Forms and Effects
• Sources and Control
• Characterization and Measurement
Module 8: Wafer Cleaning and Surface Preparation
• Wafer Cleaning Strategies
• Chemical Cleaning
• Aqueous Chemical Cleaning Equipment
• Mechanical Cleaning
• Newer Techniques (e.g., SCCO2, MD)
Module 9: Vacuum, Thin Film and Plasma Fundamentals
• Vacuum Fundamentals
• Thin Film Fundamentals
• Plasma Fundamentals
Module 10: CVD 1: Basics, LPCVD, Epitaxy
• CVD Basics
• LPCVD Films
• LPCVD Nitride/Poly Deposition Equipment
• Epi Basics
• Epi Process Applications
• Epi Deposition Process
• Epi Deposition Equipment
Module 11: PVD
• PVD (Physical Vapour Deposition) Basics
• Sputter Deposition Process
• PVD Equipment
• Al-Based Interconnect
• Step Coverage and Contact/Via Hole Filling
• Metal Film Evaluation
• Electrostatic Chucks
Module 12: Lithography 1: Photoresist Processing
• Basic Lithography Process
• Photoresist Materials
• DUV Photoresist Process Flow
• Photoresist Processing Systems
Module 13: Lithography 2: Image Formation
• Basic Optics
• Imaging
• Overview of Imaging Equipment
• Actinic Illumination
• Exposure Tools
Module 14: Lithography 3: Registration, Reticles, RETs
• Registration
• Reticles
• Resolution Enhancement Techniques (RETs)
• The Evolution of Optical Lithography (EUV)
Module 15: Etch
• Etch Terminology
• Wet Etch Chemistries and Equipment
• Dry Etch Processes
• Physics and Chemistry of Plasma Etching
• Dry Etch Applications
• Dry Etch Equipment
Module 16: CVD 2: PECVD
• CVD Basics
• PECVD Equipment
• CVD Films
• Step Coverage
Module 17: CMP
• Planarization Basics
• CMP Basics
• CMP Processes
• Process Challenges
• Equipment
• Process Control
Module 18: Copper Interconnect, ECD, Low-k Dielectrics
• The Need for Cu and low-k IMDs
• Damascene Process
• Cu ECD
• Low-κ IMDs
• Cu Integration Challenges
Module 19: Process Evolution: Gate and Capacitor Dielectrics, Silicides, Gates
• Process Evolution
• Evolution of Gate and Capacitor Dielectrics
• Evolution of Silicides/Gates
Module 20: ALD, FinFETs, Misc. Processing Techniques
• Atomic Layer Deposition (ALD)
• Silicon on Insulator (SOI) Technology
• Strained Silicon
• FinFETs and Other Non-traditional/3D Transistor Designs
• Next Generation Metals
• 3-D NAND Flash Memory