Dr. Gambino received the B.S. degree in materials science from Cornell University, Ithaca, NY, in 1979, and the PhD degree in materials science from the Massachusetts Institute of Technology, Cambridge, MA, in 1984.
He joined IBM, Hopewell Junction, NY, in 1984, where he worked on silicide processes for Bipolar and CMOS devices. In 1992, he joined the DRAM development alliance at IBM's Advanced Semiconductor Technology Center, Hopewell Junction, NY. While there, he developed contact and interconnect processes for 0.25-, 0.175-, and 0.15-um DRAM products. In 1999, he joined IBM's manufacturing organization in Essex Junction, VT, where he has worked on copper interconnect processes for CMOS logic technology.
Since 2015 Dr. Gambino holds a postion as Senior Process Integration Engineer at ON Semiconductor in Oregon, USA.
He has published over 90 technical papers and holds over 100 patents.
Dr. Gambino has been a member of the Continuing Education Institute-Europe faculty since 2007.
Course 035 Introduction to Semiconductor Packaging Technology
Course 036 Silicon Device Technology: Materials and Processing Overview
Course 037 Power Semiconductor Device Technology