Dr. Jeff Gambino, ON Semiconductor, United States, is teaching this advanced 3-day course, which will provide a high-level overview of the packaging options for semiconductor devices. This course covers design considerations, packaging materials, assembly processes, yield, and reliability.
The course is addressed to a broad audience and is not intended as a research review, although it will be taught at a high level and in many areas will require familiarity with the subject matter.
No payment now. We will contact you for firm registration in good time before course date.
Early Bird Price valid until: Feb 08, 2024