Dr. Ehrenfried Zschech, technical consultant and professor at Brandenburg University of Technology Cottbus-Senftenberg, Germany, is teaching this 3-days course about defect inspection, metrology, and failure analysis in advanced packaging, with the particular focus on materials-related challenges and advanced analytical techniques.
Expand your knowledge of the processing, materials, performance, and reliability aspects of heterogeneous integration of chiplets. Let Professor Zschech guide you all the way from 3D advanced packaging technologies through fault isolation and failure analysis up to the kinetics of degradation processes and reliability challenges. This course will include novel aspects of high-performance computing and AI applications that are driving the demand for increased functionality, performance, and reliability.
Instructor
Prof. Dr. Ehrenfried Zschech
Professor Dr. Zschech is a consultant and professor at Brandenburg University of Technology, Cottbus, Germany.
Dr. Zschech has been a member of the Continuing Education Institute-Europe Faculty since 2009.