Professor Dr. Ehrenfried Zschech,consultant and professor at Brandenburg University of Technology, Cottbus, Germany, is teaching this 3-day course about on-chip interconnects and 3D-stacked integrated circuits.
Expand your knowledge of the processing, materials, performance and reliability aspects of on-chip interconnects and 3D-stacked integrated circuits. Let Professor Zschech guide you all the way from deposition and patterning of metals and dielectric films through advanced packaging concepts up to the performance and reliability challenges. This course will include novel aspects of mobile communication and connectivity, as well as demands for applications in automotive industry
Instructor
Prof. Dr. Ehrenfried Zschech
Professor Dr. Zschech is a consultant and professor at Brandenburg University of Technology, Cottbus, Germany.
Dr. Zschech has been a member of the Continuing Education Institute-Europe Faculty since 2009.