Professor Dr. Ehrenfried Zschech, Fraunhofer Institute for Ceramic Technologies and Systems in Dresden, Germany, is teaching this course about On-Chip Interconnects and 3D-Stacked Integrated Circuits.
Due to Covid-19, and the uncertain travel recommendations for Autumn 2020, it is decided that this course is planned to run Online only. The daily schedule will be adjusted to fit remote training, with less hours per day divided into extra days. Make a preliminary booking and we will keep you updated.
Expand your knowledge of the processing, materials, performance and reliability aspects of on-chip interconnects and 3D-stacked integrated circuits. Let Professor Zschech guide you all the way from deposition and patterning of metals and dielectric films through advanced packaging concepts up to the performance and reliability challenges. This course will include novel aspects of mobile communication and connectivity, as well as demands for applications in automotive industry.
No payment now. We will contact you for firm registration in good time before course date.
Early Bird Price valid until: Aug 24, 2020