Professor Dr. Ehrenfried Zschech, Fraunhofer Institute for Ceramic Technologies and Systems in Dresden, Germany, is teaching this 3-day course about on-chip interconnects and 3D-stacked integrated circuits.
Expand your knowledge of the processing, materials, performance and reliability aspects of on-chip interconnects and 3D-stacked integrated circuits. Let Professor Zschech guide you all the way from deposition and patterning of metals and dielectric films through advanced packaging concepts up to the performance and reliability challenges. This course will include novel aspects of mobile communication and connectivity, as well as demands for applications in automotive industry
No payment now. We will contact you for firm registration in good time before course date.
Early Bird Price valid until: Sep 21, 2022