Overview

Professor Ehrenfried Zschech, Fraunhofer Institute for Ceramic Technologies and Systems, Germany is teaching this 3-day course in On-Chip and 3D Interconnects.

Expand your knowledge of the processing, materials, and reliability aspects of on-chip interconnects and 3D-stacked integrated circuits.

Let Professor Zschech guide you all the way from deposition and patterning of metal and dielectric films up to the performance and reliability challenges of the rapidly evolving 3D TSV technology.

This course will provide an overview of processes, materials and reliability for on-chip and 3D TSV interconnects.This course will include novel aspects of the mobile communication and connectivity, as well as applications in automotive industry in particular.

Course Content
Course 076 On-Chip and 3D Interconnects - Technology, Performance and Reliability
Location
Date
Open Course Price
Preliminary Booking
Dresden, Germany
October 07 - 09, 2019
Early Bird €1,885.00 Regular Price €2,095.00

Early Bird Price valid until: Aug 05, 2019

Dresden, Germany
March 30 - April 01, 2020
Early Bird €1,885.00 Regular Price €2,095.00

Early Bird Price valid until: Feb 03, 2020

Instructor
Instructor Zschech Element
Professor Ehrenfried Zschech

Professor Dr. Zschech is Department Head for Microelectronic Materials and Nanoanalysis at Fraunhofer Institute for Ceramic Technologies and Systems in Dresden, Germany.

Dr Zschech has been a member of the Continuing Education Institute-Europe Faculty since 2009.
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