Overview

Professor Dr. Ehrenfried Zschech, Fraunhofer Institute for Ceramic Technologies and Systems in Dresden, Germany, is teaching this 3-day course about On-Chip Interconnects and 3D-Stacked Integrated Circuits.

Expand your knowledge of the processing, materials, performance and reliability aspects of on-chip interconnects and 3D-stacked integrated circuits. Let Professor Zschech guide you all the way from deposition and patterning of metals and dielectric films through advanced packaging concepts up to the performance and reliability challenges. This course will include novel aspects of mobile communication and connectivity, as well as demands for applications in automotive industry.

Course Content
Course 076 On-Chip and 3D Interconnects - Technology, Performance and Reliability
Location
Date
Seat Reservation
Dresden, Germany
March 30 - April 01, 2020

No payment now. We will contact you for firm registration in good time before course date.

€2,305.00
Dresden, Germany
October 19 - 21, 2020

No payment now. We will contact you for firm registration in good time before course date.

Early Bird €2,075.00 Regular Price €2,305.00

Early Bird Price valid until: Aug 24, 2020

Instructor
Instructor Zschech Element
Professor Ehrenfried Zschech

Professor Dr. Zschech is Department Head for Microelectronic Materials and Nanoanalysis at Fraunhofer Institute for Ceramic Technologies and Systems in Dresden, Germany.

Dr Zschech has been a member of the Continuing Education Institute-Europe Faculty since 2009.
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