Course 076 On-chip and 3D Interconnects - Technology, Performance, and Reliability

Professor Dr. Ehrenfried Zschech, deepXscan GmbH Dresden and Dresden University of Technology, Germany, is teaching this 3-day course about on-chip interconnects and 3D-stacked integrated circuits.

Expand your knowledge of the processing, materials, performance and reliability aspects of on-chip interconnects and 3D-stacked integrated circuits. Let Professor Zschech guide you all the way from deposition and patterning of metals and dielectric films through advanced packaging concepts up to the performance and reliability challenges. This course will include novel aspects of mobile communication and connectivity, as well as demands for applications in automotive industry