Overview

Dr. Maxime Darnon, LN2/CNRS, Sherbrooke, Canada is teaching this 4-day course in Plasma Etching for CMOS Technology and ULSI Applications.

This course is intended to provide an understanding of plasma processes for CMOS applications and ULSI technology. We will discuss fundamental and practical aspects of front end and back end plasmaprocesses for deep submicron CMOS logic processes.  

The course is based on experimental results obtained using commercial etchers connected to very powerful diagnostics of the plasma and the plasma surface interaction.

The discussions cover several aspectsof etch processes of materials integrated in advanced CMOS devices,etch mechanisms, and situations that may be encountered for some important plasma processes.

Option 2: Take the short Ecourse #089 Plasma Etching for Microelectronics Applications. Combining self-paced e-learning with live weekly sessions with the instructor. Duration in total is two weeks of effective learning. Content based on the first two days of the public course #088

Option 3: Take the full Ecourse #090 Plasma Etching for Microelectronics Applications: from Fundamental to Practical ApplicationsCombining self-paced e-learning with live weekly sessions with the instructor. Duration in total is four weeks of effective learning. Content based on complete agenda of the public course #088. 

Course Content
Course 088 Plasma Etching for CMOS Technology and ULSI Applications
Location
Date
Seat Reservation
This course is currently not scheduled. If interested in the topic, please send us an email at cei@cei.se
Instructor
Instructor Dr. Maxime Darnon Element
Dr. Maxime Darnon

PhD at LN2/CNRS, Sherbrooke, Canada.

Dr. Darnon has been a member of the Continuing Education Institute-Europe faculty since 2011.

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